641973-1 - TE Connectivity

Description: Configuration Features: Number of Rows 3 | PCB Mount Orientation Vertical | Number of Positions 12 | Number of Power Positions 12 | Contact Features: Contact Mating Area Plating Material Thickness 3.81 – 5.08 MICM | Contact Layout Matrix | Contact Type Pin | Contact Retention Within Housing Without | Contact Current Rating (Max) 12 AMP | Multiple Contact Types Without | Contact Mating Area Plating Material Thickness 150 – 200 MICIN | PCB Contact Termination Area Plating Material Pre-Tin | Contact Mating