641975-1 - TE Connectivity

Description: Configuration Features: PCB Mount Orientation Vertical | Number of Positions 15 | Number of Power Positions 15 | Number of Rows 3 | Contact Features: Contact Current Rating (Max) 12 AMP | Contact Mating Area Plating Material Thickness 3.81 – 5.08 MICM | PCB Contact Termination Area Plating Material Pre-Tin | Contact Layout Matrix | Contact Retention Within Housing Without | Contact Mating Area Plating Material Thickness 150 – 200 MICIN | Contact Type Pin | Contact Mating Area Plating Material Tin | Mult