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644750-3 - TE Connectivity

Description: Configuration Features: PCB Mount Orientation Vertical | Number of Positions 3 | Number of Rows 1 | Number of Power Positions 3 | Contact Features: Contact Base Material Copper Alloy | Contact Retention Within Housing Without | Contact Mating Area Plating Material Thickness 2.54 MICM | Contact Mating Area Plating Material Tin | Contact Mating Area Plating Material Thickness 100 MICIN | PCB Contact Termination Area Plating Material Tin | Mating Post Length 10.16 MM | Mating Post Length .4 INCH | Contact Layo

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