Description: Configuration Features: Number of Power Positions 2 | Number of Signal Positions 24 | PCB Mount Orientation Right Angle | Number of Rows 4 | Number of Positions 26 | Contact Features: Contact Retention Within Housing Without | Contact Underplating Material Nickel | Contact Current Rating (Max) 42 AMP | Contact Mating Area Plating Material Gold Flash over Palladium Nickel | PCB Contact Termination Area Plating Material Tin | Contact Mating Area Plating Material Thickness 3 MICIN | Contact Underplating Materi