6450540-1 - TE Connectivity

Description: Configuration Features: PCB Mount Orientation Vertical | Number of Power Positions 2 | Number of Rows 4 | Number of Positions 26 | Number of Signal Positions 24 | Contact Features: Contact Mating Area Plating Material Gold Flash over Palladium Nickel | Contact Retention Within Housing Without | Contact Mating Area Plating Material Thickness .076 MICM | PCB Contact Termination Area Plating Material Tin | Power Contact Base Material Tin | Contact Underplating Material Thickness 3.43 MICM | Contact Mating Area