645952-1 - TE Connectivity

Description: Body Features: Sleeve Plating Material Tin | Sleeve Material Copper | Configuration Features: Compatible With Wire & Cable Type Discrete Wire | Contact Features: Contact Base Material Beryllium Copper | Contact Spring Plating Material Tin | Contact Spring Plating Thickness 30 MICIN | Contact Mating Area Plating Material Thickness 2.54 MICM | Contact Current Rating (Max) 4 AMP | Contact Spring Plating Thickness 3.81 MICM | Dimensions: Socket Length 4.67 MM | Mating Pin Diameter Range .014 – .026 INCH | PCB