645952-2 - TE Connectivity
Description: Body Features: Sleeve Plating Material Tin | Sleeve Material Copper | Configuration Features: Compatible With Wire & Cable Type Discrete Wire | Contact Features: Contact Spring Plating Thickness .762 MICM | Contact Mating Area Plating Material Thickness 30 MICM | Contact Spring Plating Material Gold | Contact Mating Area Plating Material Thickness 30 MICIN | Contact Current Rating (Max) 4 AMP | Contact Base Material Beryllium Copper | Contact Spring Plating Thickness 30 MICIN | Dimensions: PCB Thickness (Re