647290-1 - TE Connectivity

Description: Configuration Features: Number of Rows 1 | Number of Positions 3 | PCB Mount Orientation Vertical | Number of Power Positions 3 | Contact Features: Contact Mating Area Plating Material Thickness 100 MICM | Contact Base Material Copper Alloy | PCB Contact Termination Area Plating Material Thickness 100 MICIN | Contact Retention Within Housing Without | Contact Mating Area Plating Material Thickness 2.54 MICIN | PCB Contact Termination Area Plating Material Tin | PCB Contact Termination Area Plating Material