6643274-1 - TE Connectivity

Description: Configuration Features: Number of Positions 1 | Board-to-Board Configuration Parallel | Number of Signal Positions 0 | Number of Rows 1 | PCB Mount Orientation Vertical | Number of Power Positions 0 | Contact Features: PCB Contact Termination Area Plating Material Silver | Contact Mating Area Plating Material Thickness 5.08 MICM | Contact Mating Area Plating Material Thickness 200 MICIN | Contact Current Rating (Max) 35 AMP | Contact Type Pin | Contact Mating Area Plating Material Silver | PCB Contact Termi