6648400-1 - TE Connectivity
Description: Contact Features: Mating Pin Diameter .142 INCH | Contact Size Size 8 | PCB Contact Termination Area Plating Material Thickness 5.08 – 7.62 MICM | Contact Base Material Copper | Mating Pin Diameter 3.6 MM | Contact Mating Area Plating Material Gold | Contact Underplating Material Thickness 1 MICM | Contact Retention Within Housing Without | PCB Contact Termination Area Plating Material Thickness 200 – 300 MICIN | Contact Underplating Material Thickness 40 MICIN | Contact Current Rating (Max) 75 AMP | Co