6648417-1 - TE Connectivity
Description: Contact Features: Contact Underplating Material Thickness 40 MICIN | Mating Pin Diameter 9.06 MM | Contact Current Rating (Max) 200 AMP | Contact Underplating Material Nickel | Mating Pin Diameter .357 INCH | Contact Size Size 0 | Contact Mating Area Plating Material Gold | Contact Mating Area Plating Material Thickness .76 MICM | Contact Type Socket | Contact Underplating Material Thickness 1 MICM | Contact Base Material Copper | Contact Mating Area Plating Material Thickness 30 MICIN | Contact Retention W