66507-2 - TE Connectivity

Description: Contact Features: Contact Mating Area Plating Material Gold | Contact Base Material Brass | Mating Pin Diameter 1.02 MM | Contact Underplating Material Nickel | Contact Type Pin | Contact Size Size 20 | Mating Pin Diameter .04 INCH | Contact Current Rating (Max) 1.2 AMP | Contact Mating Area Plating Material Thickness 50 MICIN | Dimensions: Wire Size 28 – 24 AWG | Wire Size .08 – .2 MMSQ | Compatible Insulation Diameter Range .76 – 1.02 MM | Compatible Insulation Diameter Range .03 – .04 INCH | Iden