Part Image

66598-2 - TE Connectivity

Description: Contact Features: Wire Contact Termination Area Plating Thickness 1.27 MICM | Contact Underplating Material Thickness .76 MICM | Contact Retention Within Housing With | Contact Type Socket | Contact Underplating Material Thickness 30 MICIN | Contact Current Rating (Max) 13 AMP | Wire Contact Termination Area Plating Thickness 50 MICIN | Contact Size Size 16 | Wire Contact Termination Area Plating Material Tin | Mating Pin Diameter 1.57 MM | Contact Mating Area Plating Material Gold | Contact Orientation Str

Download 66598-2 Model
Schematic
symbols
Schematic symbol is unavailable for download
PCB
footprints
PCB footprint is unavailable for download
3D
models
3D model is unavailable for download
Layers
Zoom
Zoom Full
Drag mouse to rotate
Mouse wheel to zoom