66740-8 - TE Connectivity

Description: Contact Features: Contact Underplating Material Copper | Mating Tab Thickness 2.67 MM | Contact Current Rating (Max) 15 AMP | Contact Base Material Copper | Wire Contact Termination Area Plating Thickness 1.27 MICM | Contact Mating Area Plating Material Thickness 1.27 MICM | Wire Contact Termination Area Plating Material Tin-Lead | Contact Mating Area Plating Material Tin-Lead | Mating Tab Width 5.84 MM | Mating Tab Thickness .105 INCH | Mating Tab Width .23 INCH | Wire Contact Termination Area Plating Mate