745229-2 - TE Connectivity

Description: Contact Features: Contact Base Material Brass | Contact Underplating Material Nickel | Contact Mating Area Plating Material Gold | Contact Size Size 20 | Contact Mating Area Plating Material Thickness 30 MICIN | Contact Current Rating (Max) 3.1 AMP | PCB Contact Termination Area Plating Material Gold Flash | Mating Pin Diameter .04 INCH | Mating Pin Diameter 1.02 MM | Contact Type Pin | Dimensions: Wire Size 22 – 18 AWG | Compatible Insulation Diameter Range .068 INCH | Wire Size .4 – .8 MMSQ | Identifi