Description: Contact Features: Contact Current Rating (Max) 3.1 AMP | Contact Mating Area Plating Material Gold Flash | Contact Size Size 20 | Contact Mating Area Plating Material Thickness 50 MICIN | Contact Type Pin | Contact Base Material Brass | Mating Pin Diameter 1.02 MM | PCB Contact Termination Area Plating Material Gold Flash | Mating Pin Diameter .04 INCH | Contact Underplating Material Nickel | Contact Color Bands Green | Dimensions: Wire Size .4 – .8 MMSQ | Wire Size 22 – 18 AWG | Compatible Insulation D