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745230-2 - TE Connectivity

Description: Contact Features: Contact Current Rating (Max) 3.1 AMP | Contact Size Size 20 | Contact Type Socket | PCB Contact Termination Area Plating Material Gold Flash | Contact Mating Area Plating Material Thickness 30 MICIN | Mating Pin Diameter .04 INCH | Contact Underplating Material Nickel | Contact Mating Area Plating Material Gold | Contact Base Material Phosphor Bronze | Dimensions: Wire Size .4 – .8 MMSQ | Compatible Insulation Diameter Range .068 INCH | Wire Size 22 – 18 AWG | Identification Marking: C

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