765204-5 - TE Connectivity
Description: Configuration Features: Number of Signal Positions 0 | PCB Mount Orientation Right Angle | Number of Rows 1 | Number of Power Positions 12 | Number of Positions 12 | Contact Features: Contact Mating Area Plating Material Silver | Contact Layout Matrix | Contact Base Material Copper Alloy | Contact Mating Area Plating Material Thickness 100 – 150 MICIN | Contact Underplating Material Nickel | Contact Mating Area Plating Material Thickness 2.54 – 3.81 MICM | Contact Current Rating (Max) 45 AMP | Contact T