770986-3 - TE Connectivity

Description: Contact Features: Contact Mating Area Plating Material Thickness .76 MICM | Mating Pin Diameter .039 INCH | Contact Mating Area Plating Material Thickness 30 MICIN | Wire Contact Termination Area Plating Thickness 2.54 MICM | Contact Base Material Brass | Contact Retention Within Housing With | Contact Underplating Material Thickness 1.27 MICM | Contact Orientation Straight | Wire Contact Termination Area Plating Material Tin-Lead | Contact Mating Area Plating Material Gold | Contact Underplating Material T