KW45B41Z53AFPBT - NXP
Description: Not Recommended for New Designs - Package:HVQFN40, plastic thermal enhanced very thin quad flat package; no leads, wettable flanks; 40 terminals; 0.5 mm pitch, 6 mm x 6 mm x 0.85 mm bodyProduct:KW45: 32-Bit Bluetooth<sup>®</sup> 5.3 Long-Range MCUs with CAN FD and LIN Bus Options, Arm<sup>®</sup> Cortex<sup>®</sup>-M33 CoreMicrocontroller (MCU) with Bluetooth Low Energy (BLE), CAN, and integrated secure enclave for secure car access and other automotive applications.
