Part Image

LPC5502JBD64E - NXP

Description: plastic thermal enhanced thin quad flat package; 64 leads; 0.5 mm pitch, 10 mm x 10 mm x 1 mm body

Download LPC5502JBD64E Model
Schematic
symbols
Schematic symbol is unavailable for download
PCB
footprints
PCB footprint is unavailable for download
3D
models
3D model is unavailable for download
Layers
Zoom
Zoom Full Zoom Full
Drag mouse to rotate
Mouse wheel to zoom