MBR1060G - onsemi

Description: Low Forward Voltage; Lead Temperature for Soldering Purposes: 260 °C Max. for 10 Seconds; Low Power Loss/High Efficiency; Epoxy Meets UL94, VO at 1/8"; 150 °C Operating Junction Temperature; Case: Epoxy, Molded; Low Stored Charge Majority Carrier Conduction Mechanical Characteristics:; Weight: 1.9 grams (approximately); High Surge Capacity; Guard-Ring for Stress Protection; Finish: All External Surfaces Corrosion Resistant and Terminal Leads are Readily Solderable; Pb-Free Packages are Available