MBRAF360T3G - onsemi

Description: Low Profile Package for Space Constrained Applications; Rectangular Package for Automated Handling; Highly Stable Oxide Passivated Junction; 150°C Operating Junction Temperature; Guard-Ring for Stress Protection; These are Pb-Free and Halide-Free Devices Mechanical Characteristics:; Case: Epoxy, Molded, Epoxy Meets UL 94, V-0; Weight: 95 mg (approximately); Finish: All External Surfaces Corrosion Resistant and Terminal Leads are Readily Solderable; Lead and Mounting Surface Temperature for Soldering Purpose