MBRF10H150CTG - onsemi

Description: Low Forward Voltage; Low Power Loss/High Efficiency; High Surge Capability; 10 A Total (5 A Per Diode Leg); Guard-Ring for Stress Protection; This is a Pb-Free Device Mechanical Characteristics:; Case: Epoxy, Molded; Epoxy Meets UL 94 V-0 @ 0.125 in; Weight (Approximately): 1.9 Grams; Finish: All External Surfaces Corrosion Resistant and Terminal Leads are Readily Solderable; Lead Temperature for Soldering Purposes: 260C Max. for 10 Seconds