MBRF20200CTG - onsemi

Description: Guardring for Stress Protection; Epoxy Meets UL94, VO at 1/8"; Very Low Forward Voltage Drop; Marking: B20200; Electrically Isolated. No Isolation Hardware Required.; Case: Epoxy, Molded; Lead Temperature for Soldering Purposes: 260 °C Max. for 10 Seconds; Weight: 1.9 grams (approximately); Finish: All External Surfaces Corrosion Resistant and Terminal Leads are Readily Solderable; UL Recognized File #E69369 Mechanical Characteristics:; Highly Stable Oxide Passivated Junction; Matched Dual Die Construction;