Part Image

MBRM110ET1G - onsemi

Description: Low IR Extends Battery Life; Low Profile - Maximum Height of 1.1 mm; Small Footprint - Footprint Area of 8.45 mm2; 150°C Operating Junction Temperature; Low Thermal Resistance with Direct Thermal Path of Die on Exposed Cathode Heat Sink Mechanical Characteristics:; Powermite is JEDEC Registered as D0-216AA; Case: Molded Epoxy; Epoxy Meets UL 94V-O at 1/8 inch; Weight: 62 mg (approximately); Lead and Mounting Surface Temperature for Soldering Purposes: 260°C Maximum for 10 Seconds; Pb-Free Packages are Avail

Download MBRM110ET1G Model
Schematic
symbols
Schematic symbol is unavailable for download
PCB
footprints
PCB footprint is unavailable for download
3D
models
3D model is unavailable for download
Layers
    Zoom
    Zoom Full
    Middle click on footprint to measure