MURD530T4G - onsemi

Description: Ultrafast 50 Nanosecond Recovery Time; Low Forward Voltage Drop; Low Leakage; Case: Epoxy, Molded; Weight: 0.4 Gram (Approximately); Finish: All External Surfaces Corrosion Resistant and Terminal Leads are Readily Solderable; Lead and Mounting Surface Temperature for Soldering Purposes: 260C Max. for 10 Seconds; AEC-Q101 Qualified and PPAP Capable; SURD8 Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements