NTHD4502NT1G - onsemi

Description: Planar Technology Device Offers Low RDS(on) and Fast Switching Speed; Leadless ChipFET™ Package has 40% Smaller Footprint than TSOP-6. Ideal Device Applications Where Board Space is at a Premium.; ChipFET™ Package Exhibits Excellent Thermal Capabilities. Ideal for Applications Where Heat Transfer is Required.