SPZT751T1G - onsemi

Description: The SOT-223 Package can be soldered using wave or reflow.; SOT-223 package ensures level mounting, resulting in improved thermal conduction, and allows visual inspection of soldered joints. The formed leads absorb thermal stress during soldering, eliminating the possibility of damage to the die; NPN Complement is PZT651T1; High Current: 2.0 Amp; S Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AEC-Q101 Qualified and PPAP Capable; These Devices are Pb-Free