TJA1128ATK - NXP
Description: plastic, thermal enhanced very thin small outline package; no leads; 14 terminals, 0.65 mm pitch, 4.5 mm x 3 mm x 0.85 mm body
Description: plastic, thermal enhanced very thin small outline package; no leads; 14 terminals, 0.65 mm pitch, 4.5 mm x 3 mm x 0.85 mm body
