UWD1H101MCL1GS - Nichicon

Description: Corresponding with 260°C peak reflow soldering Recomended reflow condition : 260°C peak 5 sec. 230°C over 60 sec. 2 times (φ10 × 10 : 1 time) Chip type, low impedance temperature range up to +105°C. Designed for surface mounting on high density PC board. Applicable to automatic mounting machine fed with carrier tape. Compliant to the RoHS directive (2011/65/EU).