W29N02KVSIAF - Winbond

Description:  Basic Features – Density: 2Gbit (Single chip solution) – Vcc: 2.7V to 3.6V – Bus width: x8 – Operating temperature  Industrial: -40°C to 85°C  Single-Level Cell (SLC) technology  Organization – Density: 2G-bit/256M-byte – Page size  2,176 bytes – Block size  64 pages  Highest Performance – Read performance (Max.)  Random read: 25us  Sequential read cycle: 25ns – Write Erase performance  Page program time: 250us (typ.)  Block erase time: 2ms (typ.) – Endurance: 60,000 Erase/Pr