W29N04GVBJAF - Winbond

Description: Basic Features – Density: 4Gbit (Single chip solution) – Vcc: 2.7V to 3.6V – Bus width: x8 – Operating temperature ▪ Industrial: -40°C to 85°C • Single-Level Cell (SLC) technology. • Organization – Density: 4G-bit/512M-byte – Page size ▪ 2,112 bytes (2048 + 64 bytes) – Block size ▪ 64 pages (128K + 4K bytes) • Highest Performance – Read performance (Max.) ▪ Random read: 25us ▪ Sequential read cycle: 25ns – Write Erase performance ▪ Page program time: 250us(typ.) ▪ Block erase time: 2ms(ty