Part Image

XC7Z010-1CLG225C - AMD

Description: CLG225 Wire-Bond Chip-Scale BGA (XC7Z010 and XA7Z010) (0.8 mm Pitch)

Download XC7Z010-1CLG225C Model
Schematic
symbols
Schematic symbol is unavailable for download
PCB
footprints
PCB footprint is unavailable for download
3D
models
3D model is unavailable for download
Layers
    Zoom
    Zoom Full
    Middle click on footprint to measure