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02013J3R3ABSTR - Kyocera AVX

Description: Silicon RF Capacitors / Thin Film 25V 3.3pF .05pFTol T hinFilm 0201

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Symbol
02013J3R3ABSTR - Kyocera AVX - PCB symbol
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PCB Footprints
02013J3R3ABSTR - Kyocera AVX PCB footprint - Capacitor Chip Non-polarised - Capacitor Chip Non-polarised - 0201.-1
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3D Models
02013J3R3ABSTR - Kyocera AVX - 3D model - Capacitor Chip Non-polarised - 0201.-1
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02013J3R3ABSTR Details

  • Manufacturer Part Number:

    02013J3R3ABSTR

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    CHIP

  • Reach Compliance Code:

    Compliant

  • ECCN Code:

    EAR99

  • HTS Code:

    8532.25.00.45

  • Factory Lead Time:

    14 Weeks

  • Manufacturer:

    Kyocera AVX Components

  • YTEOL:

    6

  • Capacitance:

    0.0000033 µF

  • Capacitor Type:

    FILM CAPACITOR

  • Dielectric Material:

    SILICON DIOXIDE AND OXYNITRIDE

  • Height:

    0.225 mm

  • JESD-609 Code:

    e3

  • Length:

    0.6 mm

  • Mounting Feature:

    SURFACE MOUNT

  • Negative Tolerance:

    1.5152%

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Shape:

    RECTANGULAR PACKAGE

  • Package Style:

    SMT

  • Packing Method:

    TR, 13 Inch

  • Positive Tolerance:

    1.5152%

  • Rated (DC) Voltage (URdc):

    25 V

  • Reference Standard:

    CECC; IATF 16949

  • Size Code:

    0201

  • Surface Mount:

    YES

  • Temperature Characteristics Code:

    J

  • Temperature Coefficient:

    30ppm/Cel ppm/°C

  • Terminal Finish:

    Tin (Sn) - with Nickel (Ni) barrier

  • Terminal Shape:

    WRAPAROUND

  • Width:

    0.325 mm

02013J3R3ABSTR Frequently Asked Questions (FAQs)

  • The recommended land pattern for the 02013J3R3ABSTR can be found in the Kyocera AVX Components' recommended land pattern document or by consulting with a PCB design expert. The land pattern should ensure proper soldering and thermal management.
  • The 02013J3R3ABSTR is a moisture-sensitive device. It's essential to follow the recommended storage and handling procedures to prevent moisture absorption. This includes storing the components in a dry environment, using desiccant packaging, and baking the components before reflow soldering if they have been exposed to moisture.
  • The maximum reflow temperature for the 02013J3R3ABSTR is typically around 260°C (500°F). However, it's recommended to consult the datasheet and follow the recommended reflow profile to ensure proper soldering and prevent damage to the component.
  • The 02013J3R3ABSTR is designed to meet the requirements of various industries, including automotive and industrial applications. However, it's essential to evaluate the component's performance in a high-vibration environment through testing and simulation to ensure its reliability and durability.
  • To ensure the reliability of the 02013J3R3ABSTR in a high-temperature environment, it's recommended to follow the recommended operating temperature range, use proper thermal management techniques, and consider derating the component's power rating to prevent overheating.

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02013J3R3ABSTR Overview

Use the download button to access the 02013J3R3ABSTR schematic symbol, PCB footprint, and 3D model.
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About Kyocera AVX

Kyocera AVX is a global leader in the design, manufacture, and supply of electronic components, including capacitors, resistors, filters, connectors, and advanced ceramic products. The company was formed as a result of Kyocera Corporation's acquisition of AVX Corporation, combining Kyocera's expertise in ceramic technologies with AVX's strength in passive electronic components. This merger has allowed Kyocera AVX to offer a broad and diversified product portfolio, serving various industries.

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