The recommended PCB footprint for the 0217.630MXP is a rectangular pad with dimensions of 1.5mm x 0.8mm, with a 0.5mm radius corner and a 0.2mm spacing between pads.
Yes, the 0217.630MXP is rated for operation up to 150°C, making it suitable for high-temperature applications. However, the device's performance and reliability may degrade at extreme temperatures.
The 0217.630MXP is designed to handle surge currents up to 100A for 10ms, making it suitable for applications where high inrush currents are expected.
Yes, the 0217.630MXP is compatible with lead-free soldering processes, making it suitable for use in RoHS-compliant applications.
The typical response time of the 0217.630MXP is 1-2 microseconds, making it suitable for applications where fast overcurrent protection is required.
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0217.630MXP Overview
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