The recommended PCB footprint for the 0217001.HXP is a rectangular pad with a size of 1.5mm x 0.8mm, with a 0.5mm spacing between pads.
Yes, the 0217001.HXP is rated for operation up to 150°C, making it suitable for high-temperature applications. However, the device's performance and reliability may degrade at extreme temperatures.
To ensure proper soldering, use a soldering iron with a temperature of 250°C to 270°C, and apply a small amount of solder paste to the PCB pads. Use a soldering technique that minimizes the risk of overheating the device.
The 0217001.HXP has a maximum surge current rating of 100A, which is the maximum current the device can withstand for a short duration (typically 8/20μs) without damage.
Yes, the 0217001.HXP is AEC-Q101 qualified, which means it meets the stringent requirements for automotive applications, including high-temperature operation and resistance to vibration and shock.
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0217001.HXP Overview
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