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0430452407 - Molex

Description: Microfit Dual Row Vertical Thru Hole Header, 24 Positions

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PCB Footprints
0430452407 - Molex PCB footprint - Other - Other - 0430452407
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3D Models
0430452407 - Molex  - 3D model - Other - 0430452407
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0430452407 Details

  • Manufacturer Part Number:

    0430452407

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Country Of Origin:

    Mainland China, Mexico, Puerto Rico, USA

  • ECCN Code:

    EAR99

  • HTS Code:

    8536.69.40.30

  • Manufacturer:

    Molex

  • YTEOL:

    8

0430452407 Frequently Asked Questions (FAQs)

  • The recommended mating sequence for the 0430452407 connector is to mate the keying feature first, followed by the shell, and finally the contacts. This ensures proper alignment and prevents damage to the connector.
  • Yes, the 0430452407 connector is designed to withstand high-vibration environments. However, it's essential to follow Molex's recommended torque specifications and ensure proper mounting to prevent connector damage or disconnection.
  • The 0430452407 connector has an operating temperature range of -40°C to 125°C. However, it's essential to note that the temperature rating may vary depending on the specific application and environmental conditions.
  • While the datasheet specifies a recommended wire gauge, it's possible to use a different gauge with the 0430452407 connector. However, it's crucial to ensure that the wire gauge meets the connector's electrical and mechanical requirements to prevent damage or performance issues.
  • To ensure proper EMI shielding with the 0430452407 connector, make sure to follow Molex's recommended shielding practices, including proper grounding, shielding termination, and connector orientation.

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0430452407 Overview

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About Molex

Molex is a global manufacturer of connectivity solutions for various industries. The company offers a wide range of products including connectors, cables, antennas, sensors, and integrated systems. Molex's products are used in diverse applications such as automotive, telecommunications, data centers, consumer electronics, industrial automation, medical devices, and aerospace.

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