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0440680254 - Molex

Description: Mini-Fit BMI, 260C Wave Solderable, 4.20mm Pitch, Dual Row, Vertical, 24 Circuits, 6.35mm PCB Thickness, with Snap-In Metal Pins, PA Polyamide Nylon 4/6, UL 94V-0, with Gold (Au) Over Nickel (Ni) Plating, without Solderable Rete

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0440680254 - Molex  - 3D model
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0440680254 Details

  • Manufacturer Part Number:

    0440680254

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    ROHS AND REACH COMPIANT

  • Country Of Origin:

    Mexico, Puerto Rico

  • ECCN Code:

    EAR99

  • HTS Code:

    8536.69.40.30

  • Manufacturer:

    Molex

  • YTEOL:

    8

  • Additional Feature:

    POLARIZED

  • Connector Type:

    RECTANGULAR POWER CONNECTOR

  • Contact Finish Mating:

    NOT SPECIFIED

  • Contact Finish Termination:

    Bright Tin (Sn) - with Nickel (Ni) barrier

  • Contact Gender:

    MALE

  • Contact Material:

    BRASS

  • Contact Style:

    SQ PIN-SKT

  • DIN Conformance:

    NO

  • Empty Shell:

    NO

  • Filter Feature:

    NO

  • IEC Conformance:

    NO

  • Insulator Material:

    POLYETHYLENE

  • JESD-609 Code:

    e3

  • MIL Conformance:

    NO

  • Mating Information:

    MULTIPLE MATING PARTS AVAILABLE

  • Mixed Contacts:

    NO

  • Mounting Type:

    BOARD

  • Operating Temperature-Max:

    105 °C

  • Operating Temperature-Min:

    -40 °C

  • Option:

    GENERAL PURPOSE

  • Termination Type:

    SOLDER

  • Total Number of Contacts:

    24

  • UL Flammability Code:

    94V-0

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0440680254 Overview

Use the download button to access the 0440680254 3D model. You can still request or build the schematic symbol and PCB footprint by using the respective build or request forms on this page.
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About Molex

Molex is a global manufacturer of connectivity solutions for various industries. The company offers a wide range of products including connectors, cables, antennas, sensors, and integrated systems. Molex's products are used in diverse applications such as automotive, telecommunications, data centers, consumer electronics, industrial automation, medical devices, and aerospace.

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