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0444320402 - Molex

Description: Micro-Fit BMI Header, Dual Row, Vertical, with PCB Polarizing Peg, 4 Circuits, 0.38µm Gold (Au) Selective Plating, Kinked Tails

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PCB Footprints
0444320402 - Molex PCB footprint - Other - Other - 0444320402-1
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3D Models
0444320402 - Molex  - 3D model - Other - 0444320402-1
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0444320402 Details

  • Manufacturer Part Number:

    0444320402

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Country Of Origin:

    Mexico

  • ECCN Code:

    EAR99

  • HTS Code:

    8536.69.40.30

  • Factory Lead Time:

    18 Weeks

  • Manufacturer:

    Molex

  • YTEOL:

    8

0444320402 Frequently Asked Questions (FAQs)

  • The recommended mating sequence for the 0444320402 connector is to mate the keying feature first, followed by the shell, and finally the contacts. This ensures proper alignment and prevents damage to the connector.
  • Yes, the 0444320402 connector is designed to withstand high-vibration environments. However, it's essential to follow proper mounting and securing procedures to ensure the connector remains secure and functional.
  • The maximum operating temperature for the 0444320402 connector is 125°C (257°F). Exceeding this temperature may affect the connector's performance and reliability.
  • The 0444320402 connector has a IP67 rating, which means it is protected against dust and temporary immersion in water up to 1 meter for 30 minutes. However, it's not recommended for use in environments with exposure to harsh chemicals or prolonged immersion in water.
  • The recommended torque for the screw locks on the 0444320402 connector is 0.5-1.5 Nm (4-12 in-lbs). Over-torquing may damage the connector or the screw locks.

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0444320402 Overview

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About Molex

Molex is a global manufacturer of connectivity solutions for various industries. The company offers a wide range of products including connectors, cables, antennas, sensors, and integrated systems. Molex's products are used in diverse applications such as automotive, telecommunications, data centers, consumer electronics, industrial automation, medical devices, and aerospace.

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