0603SFF500F/32-2 footprint, schematic symbol and 3D model by LITTELFUSE

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0603SFF500F/32-2 Details

The recommended PCB footprint for the 0603SFF500F/32-2 is a rectangular pad with dimensions of 0.063 inches (1.6 mm) x 0.031 inches (0.8 mm) with a 0.012 inches (0.3 mm) spacing between pads.
The 0603SFF500F/32-2 is rated for operation up to 125°C, but it's recommended to derate the fuse's current rating by 1.5% for every 1°C above 85°C to ensure reliable operation.
The 0603SFF500F/32-2 is designed to handle inrush currents up to 50A for 8.3ms, making it suitable for applications with high inrush currents, such as power supplies and motor drives.
Yes, the 0603SFF500F/32-2 is compatible with lead-free soldering processes and meets the requirements of the RoHS directive.
The typical time-to-blow for the 0603SFF500F/32-2 is 1-2 seconds at 500A, but this can vary depending on the application and operating conditions.

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