The recommended land pattern for the 0868LP15A020E is a rectangular pad with a size of 1.3 mm x 0.8 mm, with a non-solder mask defined (NSMD) pad shape.
To handle the component's sensitivity to moisture, it is recommended to store the components in a dry environment, and to follow the recommended baking and drying procedures before reflow soldering.
The maximum reflow temperature for the 0868LP15A020E is 260°C, with a peak temperature of 240°C for a maximum of 20 seconds.
Yes, the 0868LP15A020E is designed for high-frequency applications up to 6 GHz, with a low insertion loss and high return loss.
The operating temperature range for the 0868LP15A020E is -40°C to 125°C, with a storage temperature range of -40°C to 150°C.
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0868LP15A020E Overview
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