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0901560149 - Molex

Description: 2.54mm Pitch C-Grid III Crimp Housing Single Row, 9 Circuits, Black

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0901560149 - Molex  - 3D model
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0901560149 Details

  • Manufacturer Part Number:

    0901560149

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Country Of Origin:

    Indonesia, Ireland, Poland, Singapore

  • ECCN Code:

    EAR99

  • HTS Code:

    8536.69.40.40

  • Manufacturer:

    Molex

  • Connector Type:

    BOARD CONNECTOR

  • Contact Finish Mating:

    NOT SPECIFIED

  • Contact Material:

    NOT SPECIFIED

0901560149 Frequently Asked Questions (FAQs)

  • The recommended mating sequence for the 0901560149 connector is to mate the guide pins first, followed by the signal pins. This ensures proper alignment and prevents damage to the connector.
  • Yes, the 0901560149 connector is designed to withstand high-vibration environments. However, it's essential to follow proper mounting and fastening procedures to ensure the connector remains secure.
  • The maximum cable bend radius for the 0901560149 connector is typically 3-5 times the diameter of the cable. However, it's recommended to consult the specific cable manufacturer's guidelines for the most accurate information.
  • The 0901560149 connector is designed to operate in a wide range of temperatures (-40°C to 105°C) and humidity levels. However, it's essential to consult the datasheet and Molex's environmental specifications to ensure the connector meets the specific requirements of your application.
  • The recommended torque specification for the 0901560149 connector's screws is typically between 0.5-1.5 Nm. However, it's recommended to consult the datasheet or Molex's documentation for the most accurate information.

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0901560149 Overview

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About Molex

Molex is a global manufacturer of connectivity solutions for various industries. The company offers a wide range of products including connectors, cables, antennas, sensors, and integrated systems. Molex's products are used in diverse applications such as automotive, telecommunications, data centers, consumer electronics, industrial automation, medical devices, and aerospace.

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