EXCELLENT CLAMPING CAPABILITY, HIGH RELIABILITY, LOW IMPEDANCE
Breakdown Voltage-Max:
31.5 V
Breakdown Voltage-Min:
28.5 V
Breakdown Voltage-Nom:
30 V
Case Connection:
ISOLATED
Clamping Voltage-Max:
41.4 V
Configuration:
SINGLE
Diode Element Material:
SILICON
Diode Type:
TRANS VOLTAGE SUPPRESSOR DIODE
JESD-30 Code:
O-PALF-W2
JESD-609 Code:
e3
Non-rep Peak Rev Power Dis-Max:
1500 W
Number of Elements:
1
Number of Terminals:
2
Operating Temperature-Max:
175 °C
Operating Temperature-Min:
-65 °C
Package Body Material:
PLASTIC/EPOXY
Package Shape:
ROUND
Package Style:
LONG FORM
Peak Reflow Temperature (Cel):
260
Polarity:
UNIDIRECTIONAL
Power Dissipation-Max:
5 W
Qualification Status:
Not Qualified
Reference Standard:
UL RECOGNIZED
Rep Pk Reverse Voltage-Max:
25.6 V
Surface Mount:
NO
Technology:
ZENER
Terminal Finish:
Tin (Sn)
Terminal Form:
WIRE
Terminal Position:
AXIAL
1.5KE30ARL4G Frequently Asked Questions (FAQs)
The recommended footprint and land pattern for the 1.5KE30ARL4G can be found in the onsemi application note AND8308/D, which provides guidelines for surface mount assembly of TVS diodes.
To select the correct TVS diode, consider factors such as the maximum voltage, current, and power rating required for your application. Also, consider the clamping voltage, response time, and capacitance of the TVS diode. Consult the onsemi TVS diode selection guide for more information.
The main difference between the 1.5KE30ARL4G and the 1.5KE30CA is the package type. The 1.5KE30ARL4G is a surface-mount device (SMD) in a DO-214AC package, while the 1.5KE30CA is a through-hole device in a DO-201 package. The electrical characteristics of the two devices are similar.
Yes, the 1.5KE30ARL4G is qualified to AEC-Q101 standards, making it suitable for use in high-reliability and automotive applications. However, it is essential to review the device's qualification and certification documentation to ensure it meets the specific requirements of your application.
Follow the recommended soldering and assembly guidelines provided in the onsemi application note AND8308/D, which includes information on soldering temperatures, times, and techniques. Additionally, ensure that the PCB design and layout meet the recommended footprint and land pattern guidelines.
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1.5KE30ARL4G Overview
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