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1.5SMB30A - LITTELFUSE

Description: ESD Suppressors / TVS Diodes TVS DIODE 1500W

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PCB Footprints
1.5SMB30A - LITTELFUSE PCB footprint - Diodes Moulded - Diodes Moulded - DO-214AA (SMB J-Bend
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3D Models
1.5SMB30A - LITTELFUSE  - 3D model - Diodes Moulded - DO-214AA (SMB J-Bend
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1.5SMB30A Details

  • Manufacturer Part Number:

    1.5SMB30A

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Country Of Origin:

    Mainland China, Philippines

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.50

  • Manufacturer:

    Littelfuse Inc

  • YTEOL:

    7

  • Additional Feature:

    EXCELLENT CLAMPING CAPABILITY

  • Breakdown Voltage-Max:

    31.5 V

  • Breakdown Voltage-Min:

    28.5 V

  • Breakdown Voltage-Nom:

    30 V

  • Clamping Voltage-Max:

    53.5 V

  • Configuration:

    SINGLE

  • Diode Element Material:

    SILICON

  • Diode Type:

    TRANS VOLTAGE SUPPRESSOR DIODE

  • Forward Voltage-Max (VF):

    5 V

  • JEDEC-95 Code:

    DO-214AA

  • JESD-30 Code:

    R-PDSO-C2

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Non-rep Peak Rev Power Dis-Max:

    1500 W

  • Number of Elements:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -65 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity:

    UNIDIRECTIONAL

  • Power Dissipation-Max:

    5 W

  • Reference Standard:

    IEC-61000-4-2, 4-4

  • Rep Pk Reverse Voltage-Max:

    25.6 V

  • Reverse Current-Max:

    1 µA

  • Reverse Test Voltage:

    25.6 V

  • Surface Mount:

    YES

  • Technology:

    AVALANCHE

  • Terminal Finish:

    MATTE TIN

  • Terminal Form:

    C BEND

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    40

1.5SMB30A Frequently Asked Questions (FAQs)

  • The recommended footprint and land pattern for the 1.5SMB30A can be found in the Littelfuse application note AN9313, which provides guidelines for surface mount assembly of SMB packages.
  • To ensure proper soldering, follow the recommended soldering profile and temperature guidelines provided in the Littelfuse application note AN9313. Additionally, use a solder with a melting point of 220°C or higher, and avoid applying excessive heat or force to the component.
  • The maximum allowable voltage derating for the 1.5SMB30A is typically 10-15% of the rated voltage, depending on the specific application and environmental conditions. However, it's recommended to consult with a Littelfuse application engineer or refer to the device's datasheet for specific guidance.
  • Yes, the 1.5SMB30A can be used in high-frequency applications up to 1 GHz. However, the device's performance may be affected by parasitic inductance and capacitance, so it's essential to consider these factors in the design and layout of the circuit.
  • The 1.5SMB30A is designed to respond to overvoltage transients by clamping the voltage to a safe level, thereby protecting the downstream circuitry. The device's response time is typically in the range of 1-10 ns, depending on the magnitude and duration of the transient.

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