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1.5SMC56AT3G - onsemi

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Symbol
1.5SMC56AT3G - onsemi - PCB symbol
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PCB Footprints
1.5SMC56AT3G - onsemi PCB footprint - Diodes Moulded - Diodes Moulded - SMC CASE403-03
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3D Models
1.5SMC56AT3G - onsemi - 3D model - Diodes Moulded - SMC CASE403-03
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1.5SMC56AT3G Details

  • Manufacturer Part Number:

    1.5SMC56AT3G

  • Brand Name:

    ON Semiconductor

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Transferred

  • Package Description:

    LEAD FREE, PLASTIC, CASE 403-03, SMC, 2 PIN

  • Pin Count:

    2

  • Manufacturer Package Code:

    403-03

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.50

  • Manufacturer:

    onsemi

  • Additional Feature:

    HIGH RELIABILITY

  • Breakdown Voltage-Max:

    58.8 V

  • Breakdown Voltage-Min:

    53.2 V

  • Breakdown Voltage-Nom:

    56 V

  • Clamping Voltage-Max:

    77 V

  • Configuration:

    SINGLE

  • Diode Element Material:

    SILICON

  • Diode Type:

    TRANS VOLTAGE SUPPRESSOR DIODE

  • JESD-30 Code:

    R-PDSO-C2

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Non-rep Peak Rev Power Dis-Max:

    1500 W

  • Number of Elements:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -65 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity:

    UNIDIRECTIONAL

  • Power Dissipation-Max:

    0.75 W

  • Qualification Status:

    Not Qualified

  • Reference Standard:

    UL RECOGNIZED

  • Rep Pk Reverse Voltage-Max:

    47.8 V

  • Surface Mount:

    YES

  • Technology:

    ZENER

  • Terminal Finish:

    TIN

  • Terminal Form:

    C BEND

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

1.5SMC56AT3G Frequently Asked Questions (FAQs)

  • A good PCB layout for the 1.5SMC56AT3G should include a solid ground plane, short and wide traces for the input and output pins, and a decoupling capacitor (e.g., 0.1uF) between the VCC and GND pins. Additionally, the device should be placed as close as possible to the protection circuitry to minimize inductance.
  • To ensure proper soldering, use a soldering iron with a temperature of 250°C to 260°C, and apply a small amount of solder paste to the pads. Use a soldering technique that minimizes the risk of overheating the device, and avoid applying excessive force or pressure to the device during soldering.
  • The 1.5SMC56AT3G has an operating temperature range of -55°C to 150°C, but it's recommended to operate the device within a temperature range of -40°C to 125°C for optimal performance and reliability.
  • The 1.5SMC56AT3G is designed for low-frequency applications (e.g., power supplies, motor control). While it can be used in high-frequency applications, its performance may be limited by its internal capacitance and inductance. For high-frequency applications, consider using a device specifically designed for high-frequency operation.
  • To prevent electrostatic discharge (ESD) damage, handle the 1.5SMC56AT3G with an ESD wrist strap or mat, and ensure that the workspace is ESD-protected. Avoid touching the device's pins or exposed internal components, and use ESD-safe packaging and storage materials.

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1.5SMC56AT3G Overview

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