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10-88-3301 - Molex

Description: Headers & Wire Housings HDR RA 2X15P .1 240/110 SN

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PCB Footprints
10-88-3301 - Molex PCB footprint - Header, Unshrouded - Right Angle PTH Pin - Header, Unshrouded - Right Angle PTH Pin - 10-88-3301
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3D Models
10-88-3301 - Molex  - 3D model - Header, Unshrouded - Right Angle PTH Pin - 10-88-3301
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10-88-3301 Details

  • Manufacturer Part Number:

    10-88-3301

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Reach Compliance Code:

    Compliant

  • Country Of Origin:

    Malaysia, Mexico, USA

  • ECCN Code:

    EAR99

  • HTS Code:

    8536.69.40.40

  • Factory Lead Time:

    22 Weeks

  • Manufacturer:

    Molex

  • YTEOL:

    9.1

  • Additional Feature:

    C-GRID, HIGH PROFILE

  • Body Breadth:

    0.22 inch

  • Body Depth:

    0.292 inch

  • Body Length:

    1.4 inch

  • Body/Shell Style:

    RECEPTACLE

  • Connector Type:

    BOARD CONNECTOR

  • Contact Finish Mating:

    NOT SPECIFIED

  • Contact Finish Termination:

    Tin (Sn)

  • Contact Gender:

    MALE

  • Contact Material:

    PHOSPHOR BRONZE

  • Contact Pattern:

    RECTANGULAR

  • Contact Style:

    SQ PIN-SKT

  • DIN Conformance:

    NO

  • Dielectric Withstanding Voltage:

    600VAC V

  • Filter Feature:

    NO

  • IEC Conformance:

    NO

  • Insulation Resistance:

    1000000000 Ω

  • Insulator Color:

    BLACK

  • Insulator Material:

    GLASS FILLED POLYESTER

  • JESD-609 Code:

    e3

  • MIL Conformance:

    NO

  • Mating Contact Pitch:

    0.1 inch

  • Mating Contact Row Spacing:

    0.1 inch

  • Mating Information:

    MULTIPLE MATING PARTS AVAILABLE

  • Mixed Contacts:

    NO

  • Mounting Option 1:

    LOCKING

  • Mounting Style:

    RIGHT ANGLE

  • Mounting Type:

    BOARD

  • Number Of Connectors:

    ONE

  • Number Of PCB Rows:

    2

  • Number of Rows Loaded:

    2

  • Operating Temperature-Max:

    105 °C

  • Operating Temperature-Min:

    -40 °C

  • Option:

    GENERAL PURPOSE

  • PCB Contact Pattern:

    RECTANGULAR

  • PCB Contact Row Spacing:

    2.54 mm

  • Plating Thickness:

    150u inch

  • Rated Current (Signal):

    2.5 A

  • Reference Standard:

    UL

  • Terminal Length:

    0.11 inch

  • Terminal Pitch:

    2.54 mm

  • Termination Type:

    SOLDER

  • Total Number of Contacts:

    30

  • UL Flammability Code:

    94V-0

10-88-3301 Frequently Asked Questions (FAQs)

  • The recommended torque is 0.5-1.5 N·m (4.4-13.3 in·lb) for the screws on the 10-88-3301 connector, as specified in the Molex application notes.
  • Yes, the 10-88-3301 connector is designed to withstand vibrations up to 10G (10 Hz to 2 kHz) and can be used in high-vibration applications, but it's recommended to follow Molex's guidelines for vibration testing and to consult with a Molex representative for specific application requirements.
  • The operating temperature range for the 10-88-3301 connector is -40°C to 105°C (-40°F to 221°F), as specified in the datasheet. However, it's recommended to consult with a Molex representative for specific temperature requirements and to ensure the connector meets the application's thermal demands.
  • The 10-88-3301 connector has a moisture-sealing rating of IP67, which means it can withstand immersion in water up to 1 meter (3.3 feet) for 30 minutes. However, it's recommended to follow Molex's guidelines for environmental testing and to consult with a Molex representative for specific application requirements.
  • The mating cycle life for the 10-88-3301 connector is 500 cycles, as specified in the datasheet. However, this can vary depending on the application and usage, and it's recommended to consult with a Molex representative for specific requirements.

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10-88-3301 Overview

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About Molex

Molex is a global manufacturer of connectivity solutions for various industries. The company offers a wide range of products including connectors, cables, antennas, sensors, and integrated systems. Molex's products are used in diverse applications such as automotive, telecommunications, data centers, consumer electronics, industrial automation, medical devices, and aerospace.

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