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10AS022E3F29I1HG - Intel

Description: FPGA - Field Programmable Gate Array

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PCB Footprints
10AS022E3F29I1HG - Intel PCB footprint - BGA - BGA - 780-Pin FineLine Ball-Grid Array (FBGA) - Flip Chip - Flat Top Single-Piece Lid - A:3.35
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3D Models
10AS022E3F29I1HG - Intel  - 3D model - BGA - 780-Pin FineLine Ball-Grid Array (FBGA) - Flip Chip - Flat Top Single-Piece Lid - A:3.35
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10AS022E3F29I1HG Details

  • Manufacturer Part Number:

    10AS022E3F29I1HG

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Transferred

  • Package Description:

    FBGA-780

  • Country Of Origin:

    Mainland China, Malaysia, Taiwan, USA, Vietnam

  • HTS Code:

    8542.39.00.01

  • Manufacturer:

    Intel Corporation

  • YTEOL:

    10

  • JESD-30 Code:

    S-PBGA-B780

  • Length:

    29 mm

  • Number of CLBs:

    8033

  • Number of Inputs:

    288

  • Number of Logic Cells:

    220000

  • Number of Outputs:

    288

  • Number of Terminals:

    780

  • Operating Temperature-Max:

    100 °C

  • Operating Temperature-Min:

    -40 °C

  • Organization:

    8033 CLBS

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    BGA

  • Package Equivalence Code:

    BGA780,28X28,40

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY

  • Programmable Logic Type:

    FPGA SOC

  • Seated Height-Max:

    3.35 mm

  • Supply Voltage-Max:

    0.93 V

  • Supply Voltage-Min:

    0.87 V

  • Supply Voltage-Nom:

    0.9 V

  • Surface Mount:

    YES

  • Technology:

    20 nm

  • Terminal Form:

    BALL

  • Terminal Pitch:

    0.8 mm

  • Terminal Position:

    BOTTOM

  • Width:

    29 mm

10AS022E3F29I1HG Frequently Asked Questions (FAQs)

  • The 10AS022E3F29I1HG FPGA has an operating temperature range of 0°C to 100°C (commercial temperature range) and -40°C to 100°C (industrial temperature range).
  • Intel recommends using an external POR circuit with a voltage supervisor IC, such as the MAX809, to ensure a reliable power-on reset. The FPGA's internal POR circuit can also be used, but it may not be as reliable.
  • Intel provides guidelines for PCB layout and routing in the '10AS022E3F29I1HG FPGA PCB Design Guidelines' document. It recommends using a 4-layer PCB with a dedicated power plane, and following specific routing rules for clock and signal traces.
  • To optimize power consumption, use the Intel Quartus Prime software to optimize the design for power, enable power gating, and use the FPGA's built-in power management features. Additionally, consider using a heat sink or thermal management system to reduce heat generation.
  • The recommended settings for the internal voltage regulators can be found in the '10AS022E3F29I1HG FPGA Datasheet' and the 'Intel Quartus Prime Power Management User Guide'. The settings may vary depending on the specific application and power requirements.

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10AS022E3F29I1HG Overview

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