10AX032E4F27I3SG - Intel

10AX032E4F27I3SG Details

• Manufacturer Part Number:

  10AX032E4F27I3SG

• Rohs Code:

  Yes

• Part Life Cycle Code:

  Transferred

• Package Description:

  FBGA-672

• Country Of Origin:

  Mainland China, Malaysia, Taiwan, USA, Vietnam

• ECCN Code:

  3A991

• HTS Code:

  8542.39.00.01

• Manufacturer:

  Intel Corporation

• YTEOL:

  9.7

• JESD-30 Code:

  S-PBGA-B672

• Length:

  27 mm

• Number of CLBs:

  11990

• Number of Inputs:

  240

• Number of Logic Cells:

  320000

• Number of Outputs:

  240

• Number of Terminals:

  672

• Operating Temperature-Max:

  100 °C

• Operating Temperature-Min:

  -40 °C

• Organization:

  11990 CLBS

• Package Body Material:

  PLASTIC/EPOXY

• Package Code:

  BGA

• Package Equivalence Code:

  BGA672,26X26,40

• Package Shape:

  SQUARE

• Package Style:

  GRID ARRAY

• Programmable Logic Type:

  FIELD PROGRAMMABLE GATE ARRAY

• Qualification Status:

  Not Qualified

• Seated Height-Max:

  3.35 mm

• Supply Voltage-Max:

  0.93 V

• Supply Voltage-Min:

  0.87 V

• Supply Voltage-Nom:

  0.9 V

• Surface Mount:

  YES

• Technology:

  20 nm

• Temperature Grade:

  INDUSTRIAL

• Terminal Form:

  BALL

• Terminal Pitch:

  1 mm

• Terminal Position:

  BOTTOM

• Width:

  27 mm