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10AX048E4F29E3SG - Intel

Description: Arria 10 GX Field Programmable Gate Array (FPGA) IC 360 5664768 480000 780-BBGA, FCBGA

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PCB Footprints
10AX048E4F29E3SG - Intel PCB footprint - BGA - BGA - 780-Pin FineLine Ball-Grid Array (FBGA) - Flip Chip - Flat Top Single-Piece Lid - A:3.35
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3D Models
10AX048E4F29E3SG - Intel  - 3D model - BGA - 780-Pin FineLine Ball-Grid Array (FBGA) - Flip Chip - Flat Top Single-Piece Lid - A:3.35
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10AX048E4F29E3SG Details

  • Manufacturer Part Number:

    10AX048E4F29E3SG

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Transferred

  • Package Description:

    FBGA-780

  • Country Of Origin:

    Mainland China, Malaysia, Taiwan, USA, Vietnam

  • ECCN Code:

    3A991

  • HTS Code:

    8542.39.00.01

  • Manufacturer:

    Intel Corporation

  • YTEOL:

    9.15

  • JESD-30 Code:

    S-PBGA-B780

  • Length:

    29 mm

  • Number of CLBs:

    18359

  • Number of Inputs:

    360

  • Number of Logic Cells:

    480000

  • Number of Outputs:

    360

  • Number of Terminals:

    780

  • Operating Temperature-Max:

    100 °C

  • Organization:

    18359 CLBS

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    BGA

  • Package Equivalence Code:

    BGA780,28X28,40

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY

  • Programmable Logic Type:

    FIELD PROGRAMMABLE GATE ARRAY

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    3.35 mm

  • Supply Voltage-Max:

    0.93 V

  • Supply Voltage-Min:

    0.87 V

  • Supply Voltage-Nom:

    0.9 V

  • Surface Mount:

    YES

  • Technology:

    20 nm

  • Temperature Grade:

    OTHER

  • Terminal Form:

    BALL

  • Terminal Pitch:

    1 mm

  • Terminal Position:

    BOTTOM

  • Width:

    29 mm

10AX048E4F29E3SG Frequently Asked Questions (FAQs)

  • The maximum power consumption of the 10AX048E4F29E3SG is approximately 12W, but this can vary depending on the specific design and usage.
  • Intel recommends using a clocking scheme that includes a clock manager tile (CMT) and a phase-locked loop (PLL) to generate a stable clock signal. Additionally, it's essential to follow Intel's clocking guidelines and best practices to ensure reliable clocking.
  • The maximum frequency achievable with the 10AX048E4F29E3SG depends on the specific design and implementation. However, Intel's Quartus Prime software can help estimate the maximum frequency based on the design's complexity and resource utilization.
  • To optimize power consumption, use Intel's PowerPlay power analysis tool to identify areas of high power consumption in your design. Then, apply power-saving techniques such as clock gating, voltage scaling, and dynamic voltage and frequency scaling (DVFS).
  • Implement a reset strategy that includes a power-on reset (POR) and a reset controller to ensure a reliable and synchronous reset of all components. Additionally, use Intel's recommended reset architecture and follow best practices for reset signal routing.

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10AX048E4F29E3SG Overview

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